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dc.contributor.authorSánchez Barrera, Estiven
dc.contributor.authorEalo Cuello, Joao Luis
dc.date.accessioned2023-07-21T20:49:23Z
dc.date.available2023-07-21T20:49:23Z
dc.date.issued2023
dc.date.submitted2023
dc.identifier.citationBarrera, E. S., & Cuello, J. L. E. (2023). Measuring material thickness changes through tri-aperture digital speckle pattern interferometry. Optical Engineering, 62(1), 014108-014108.spa
dc.identifier.urihttps://hdl.handle.net/20.500.12585/12386
dc.description.abstractA configuration for the measurement of thickness changes in materials through one-shot digital speckle pattern interferometry (DSPI) was developed. The phase maps calculation was made by adding carrier fringes by the multiple aperture principle and Fourier Transform Method (FTM). With this setup, interferometry configurations verified that the simultaneous and instantaneous visualization of two opposite faces of a surface is possible. In addition, the combination of the simultaneous results obtained from both sides of the material makes it possible to determine displacements with greater sensitivity or to identify changes in their thickness. The validation and demonstrative tests were carried out with a 1-mm-thick aluminum plate with a 5-mm diameter through hole coated. Thickness changes to 2 μm were measured. © 2023 Society of Photo-Optical Instrumentation Engineers (SPIE).spa
dc.format.mimetypeapplication/pdfspa
dc.language.isoengspa
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.sourceOptical Engineeringspa
dc.titleMeasuring material thickness changes through tri-aperture digital speckle pattern interferometryspa
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datacite.rightshttp://purl.org/coar/access_right/c_abf2spa
oaire.versionhttp://purl.org/coar/version/c_b1a7d7d4d402bccespa
dc.type.driverinfo:eu-repo/semantics/articlespa
dc.type.hasversioninfo:eu-repo/semantics/draftspa
dc.identifier.doi10.1117/1.OE.62.1.014108
dc.subject.keywordsShearography;spa
dc.subject.keywordsSpeckle Patterns;spa
dc.subject.keywordsInterferometryspa
dc.rights.accessrightsinfo:eu-repo/semantics/openAccessspa
dc.rights.ccAttribution-NonCommercial-NoDerivatives 4.0 Internacional*
dc.identifier.instnameUniversidad Tecnológica de Bolívarspa
dc.identifier.reponameRepositorio Universidad Tecnológica de Bolívarspa
dc.publisher.placeCartagena de Indiasspa
dc.subject.armarcLEMB
dc.type.spahttp://purl.org/coar/resource_type/c_6501spa
oaire.resourcetypehttp://purl.org/coar/resource_type/c_6501spa


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Universidad Tecnológica de Bolívar - 2017 Institución de Educación Superior sujeta a inspección y vigilancia por el Ministerio de Educación Nacional. Resolución No 961 del 26 de octubre de 1970 a través de la cual la Gobernación de Bolívar otorga la Personería Jurídica a la Universidad Tecnológica de Bolívar.