Measuring material thickness changes through tri-aperture digital speckle pattern interferometry

Abstract

A configuration for the measurement of thickness changes in materials through one-shot digital speckle pattern interferometry (DSPI) was developed. The phase maps calculation was made by adding carrier fringes by the multiple aperture principle and Fourier Transform Method (FTM). With this setup, interferometry configurations verified that the simultaneous and instantaneous visualization of two opposite faces of a surface is possible. In addition, the combination of the simultaneous results obtained from both sides of the material makes it possible to determine displacements with greater sensitivity or to identify changes in their thickness. The validation and demonstrative tests were carried out with a 1-mm-thick aluminum plate with a 5-mm diameter through hole coated. Thickness changes to 2 μm were measured. © 2023 Society of Photo-Optical Instrumentation Engineers (SPIE).