Browsing by Author "Shorey A."

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In-Substrate Resonators and Bandpass Filters with Improved Insertion Loss in K-Band Utilizing Low Loss Glass Interposer Technology and Superlattice Conductors
(Institute of Electrical and Electronics Engineers Inc., 2016) Rahimi A.; Senior D.E.; Shorey A.; Yoon, Y.K.
In this work, we report on in-substrate passive components using a high performance glass interposer and through glass via (TGV) technology and a multi-layer superlattice conductor architecture. Minimal RF loss is achieved using low dielectric loss glass substrates and superlattice conductors featuring skin effect suppression. Half mode substrate integrated waveguide (HMSIW) resonators and two-pole bandpass filters, embedded inside a glass interposer substrate, are used as test vehicles for the demonstration of insertion loss improvement in K-band. The utilized conductor is made of 20 layers of Cu/NiFe with each pair of 360 nm/30 nm, respectively, where NiFe layers with negative permeability in frequency range of interest are used for eddy current cancelling and improving the conductor loss. Control devices using the same glass substrate and conductor made of pure copper are fabricated for comparison purposes. The glass interposer substrate (SGW3, Corning Incorporated) has a thickness of 0.13 mm and the TGV's with a diameter of 0.08 mm. Up to 0.3 dB reduction in the insertion loss is achieved by using the proposed superlattice approach on glass substrates. © 2016 IEEE.
Through-glass interposer integrated high quality RF components
(Institute of Electrical and Electronics Engineers Inc., 2014) Kim C.; Senior D.E.; Shorey A.; Kim H.J.; Thomas W.; Yoon, Y.K.
High quality and compact RF devices, using the half mode substrate integrated waveguide (HMSIW) architecture loaded with a complementary split ring resonator (CSRR), are implemented on a glass interposer layer, which therefore serves as an interconnection layer and as a host medium for integrated passive RF components. Compared with the silicon interposer approach, which suffers from large electrical conductivity and therefore substrate loss, the glass interposer has advantages of low substrate loss, allowing high quality interconnection and passive circuits, and low material and manufacturing costs. Corning fusion glass is selected as the substrate to realize the compact CSRR-loaded HMSIW resonators and bandpass filters (BPFs) working under the principle of evanescent wave amplification. Two and three pole bandpass filters are designed for broadband operation at 5.8 GHz. Thru glass vias (TGVs) are used to define the side-wall of the substrate integrated waveguiding structure. Surface micromachining techniques are used to fabricate the proposed devices. The variations of the external quality factor (Qe) of the resonator and the internal coupling coefficient (M) of the coupled resonators are studied for filter design. Operation of the filters at 5.8 GHz with a fractional bandwidth (FBW) of more than 10% for an in-band return loss of better than 20 dB and an low insertion loss of less than 1.35 dB has been obtained, which is not feasible with a usual Si interposer approach. Measurement results are presented from 2 to 10 GHz and show good agreement with simulated ones. © 2014 IEEE.