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dc.creatorEliecer Sr. D.
dc.creatorCheng X.
dc.creatorYoon Y.-K.
dc.identifier.citationProceedings - Electronic Components and Technology Conference; pp. 2062-2069
dc.description.abstractThis work explores the implementation of highly compact three dimensional (3D) integrable metamaterial based transmission lines on a low resistivity CMOS grade silicon substrate for microwave and millimeter wave applications. The composite right-left handed (CRLH) architecture is able to be integrated with an integrated circuit (IC) using a multilayer surface micromachined fabrication process as a post-CMOS process. The fabrication process employs the negative tone photo sensitive Benzocyclobutene (BCB) as a low-loss dielectric interlayer material allowing packaging compatible high performance RF circuits. Since the low temperature and multilayer fabrication is compatible with CMOS/MEMS processes, it allows the batch fabrication of multiple devices and the easy implementation of 3D vertical interconnects. The design, modeling, fabrication and on-wafer characterization are presented for 50 Ω compact multilayer finite ground coplanar waveguide (FGC) CRLH unit cells and transmission lines for broadband and multiband operation at Ku and Ka frequencies of 14 GHz and 35 GHz, respectively. Also, the comparison between the simulation and measurement results up to 40 GHz on the aforementioned 3D electromagnetic structures is provided. The left handed capacitance and inductance components of the CRLH structures are implemented with photolithographically defined Metal-Insulator-Metal (MIM) capacitors and BCB embedded meander inductors, respectively, which allows the fabrication of very compact CRLH devices. The fabricated dual band unit cell features a size of λ 0/30 at 14 GHz and an insertion loss of less than 2dB within the passband. © 2012 IEEE.eng
dc.description.sponsorshipIEEE Components, Packag. Manuf. Technol. Soc. (CPMT)
dc.format.mediumRecurso electrónico
dc.titleHighly compact surface micromachined metamaterial circuits using multilayers of low-loss Benzocyclobutene for microwave and millimeter wave applications
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dc.source.event2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
dc.subject.keywordsBatch fabrication
dc.subject.keywordsDielectric interlayers
dc.subject.keywordsDual Band
dc.subject.keywordsElectromagnetic structure
dc.subject.keywordsFabrication process
dc.subject.keywordsFinite-ground coplanar waveguides
dc.subject.keywordsLeft handed
dc.subject.keywordsLow resistivity
dc.subject.keywordsLow temperatures
dc.subject.keywordsMeander inductors
dc.subject.keywordsMetal insulator metal capacitor (MIM)
dc.subject.keywordsMillimeter-wave applications
dc.subject.keywordsMulti-band operations
dc.subject.keywordsMultilayer fabrication
dc.subject.keywordsMultilayer surfaces
dc.subject.keywordsMultiple devices
dc.subject.keywordsNegative tones
dc.subject.keywordsPass bands
dc.subject.keywordsSilicon substrates
dc.subject.keywordsSimulations and measurements
dc.subject.keywordsUnit cells
dc.subject.keywordsCMOS integrated circuits
dc.subject.keywordsComputer simulation
dc.subject.keywordsCoplanar waveguides
dc.subject.keywordsElectric lines
dc.subject.keywordsMillimeter waves
dc.subject.keywordsThree dimensional computer graphics
dc.subject.keywordsTransmission line theory
dc.subject.keywordsMIM devices
dc.rights.ccAtribución-NoComercial 4.0 Internacional
dc.identifier.instnameUniversidad Tecnológica de Bolívar
dc.identifier.reponameRepositorio UTB
dc.relation.conferenceplaceSan Diego, CA
dc.relation.conferencedate29 May 2012 through 1 June 2012

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Universidad Tecnológica de Bolívar - 2017 Institución de Educación Superior sujeta a inspección y vigilancia por el Ministerio de Educación Nacional. Resolución No 961 del 26 de octubre de 1970 a través de la cual la Gobernación de Bolívar otorga la Personería Jurídica a la Universidad Tecnológica de Bolívar.