Measuring material thickness variations through tri-aperture DSPI
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Date
2023-06-15
Authors
Sanchez Barrera, Estiven
Ealo Cuello, Joao Luis
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Abstract
A configuration for the measurement of thickness changes in materials through one-shot digital speckle pattern interferometry (DSPI) was developed. The phase maps calculation was made by adding carrier fringes by the multiple aperture principle and Fourier Transform Method (FTM). With this setup, interferometry configurations verified that the simultaneous and instantaneous visualization of two opposite faces of a surface is possible. In addition, the combination of the simultaneous results obtained from both sides of the material makes it possible to determine displacements with greater sensitivity or to identify changes in their thickness. The validation and demonstrative tests were carried out with a 1-mm thick aluminum plate with a 5-mm diameter through hole coated. Thickness changes until 2 μm was measured.
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Estiven Sánchez Barrera and Joao Luis Ealo Cuello "Measuring material thickness variations through tri-aperture DSPI", Proc. SPIE 12524, Dimensional Optical Metrology and Inspection for Practical Applications XII , 125240C (15 June 2023); https://doi.org/10.1117/12.2663667